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GOLUB 7000-DE | Barebone [2x PCIe, 2x GigE]

High-Performance Rugged PC with 2x PCIe • 9th Gen. Intel® Core™ i7/i5/i3/Celeron

The 2018 flagship rugged fanless Industrial Box-PC: The new GOLUB 7000 series, powered by 9th and 8th generation Intel® Core™ i processors with up to 8 and 6 cores architecture, respectively, providing a significant performance boost over the previous 6th and 7th generation platforms.

The GOLUB 7000 series incorporates the proven technologies for superior ruggedness and versatility, such as the effective fanless design, patented expansion cartridge and proprietary MezIO™ interface. It also includes state-of-the-art computer I/O such as USB 3.1 Gen2 with up to 10 Gbps throughput and M.2 2280 M Key socket for NVMe SSD or Intel® Optane™ memory for ultimate system performance. The numerous on-board I/O ports (GbE, USB and COM) feature advanced protection circuits to withstand ESD and overvoltage loads. This makes the GOLUB 7000 series by far the most robust embedded computer we have ever developed.

The GOLUB 7000 variants are flexible and versatile for a wide range of applications and are available with various cassette expansion options. With the GOLUB 7000 series, you get a truly robust platform that can accommodate a single PCIe card (GOLUB 7000-SE), two PCIe cards (GOLUB 7000-DE) or a single PCI card (GOLUB 7000-SE), depending on your application needs.
Key facts• 9th Gen. Intel® Core™ i7/i5/i3/Celeron
• Up to 64GB DDR4
• Fanless
• 2x PCIe, I/O Expansion slot
• Option: Digital I/O, PoE
Protection class IP20
CPU Supporting Intel® 9th/ 8th-Gen CPU (LGA1151 socket, 65W/ 35W TDP)
Chipset Intel® Q370
RAM Up to 64GB DDR4 2666/ 2400 SDRAM (two SODIMM slots)
Storage interface 2x internal SATA port for 2.5” HDD/ SSD installation, supporting RAID 0/ 1 • 1x M.2 2280 M key socket (PCIe Gen3 x4) for NVMe SSD or Intel® Optane™ memory installation • 1x full-size mSATA port (mux with mini-PCIe)
RAID 0/ 1
Ports 2x GigE, 1x Intel® I219, 1x Intel® I210; 6x GigE, 1x Intel® I219, 5x Intel® I210 • Option: IEEE 802.3at PoE+ PSE for Port 3 ~ Port 6 100W total power budget • 4x USB 3.1 Gen2 (10 Gbps) • 4x USB 3.1 Gen1 (5 Gbps) • 2x software-programmable RS-232/422/485 ports (COM1/ COM2) • 2x RS-232 ports (COM3/ COM4) • 1x VGA, supporting 1920 x 1200 resolution • 1x DVI-D, supporting 1920 x 1200 resolution • 1x DisplayPort, supporting 4096 x 2304 resolution • 1x 3.5 mm jack for mic-in and speaker-out
PCI / PCIe / mini-PCIe 2x PCIe x8 slots@Gen3, 4-lanes PCIe signals in Cassette • 1x full-size mini-PCIe socket with internal SIM socket (mux with mSATA) • 1x M.2 2242 B key socket with dual front-accessible SIM sockets, supporting dual SIM mode with selected M.2 LTE module
MezIO™-interfaces 1x MezIO® expansion port for MezIO® modules
Cooling System Passive, fanless • included fan when PCI/PCIe card is installed (recommended)
Mounting Wall mounting; option: Rack mounting; DIN-Rail
Power input 1x 3-pin pluggable terminal block for 8V to 35VDC input • 1x 3-pin pluggable terminal block for remote control and PWR LED output
Power consumption TBA
Operating system Option: Microsoft Windows® 10 (x64) • Fedora 29 • Ubuntu 16.04.5 LTS & Ubuntu 18.04.0 LTS
Operating temperature with 35W CPU -25°C to 70°C • with 65W CPU -25°C to 70°C (configured as 35W TDP); -25°C to 50°C (configured as 65W TDP)
Storage temperature -40° to 85°C
Storage humidity 10% to 90%; non-condensing
Vibration Operating, MIL-STD-810G, Method 514.6, Category 4
Shock Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II
Certificate CE/FCC Class A, according to EN 55032 & EN 55024 • UL62368-1, IEC62368-1 • UKCA
Weight / kg 3.7
Dimensions / mm 240 x 225 x 110.5
Scope of delivery 2x 3-pin terminal connector • Rubber absorber • Driver CD • Wall mounting kit
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• 13th Gen. Intel® Core™ i9/i7/i5/i3/Celeron
• Up to 64GB DDR5
• Fanless
• 2x PCIe, I/O Expansion slot
• Option: Digital I/O, PoE+
Prices on request